Capability

2-12 Layer

6-18 Layer

Max.board thickness

78 mil (2.00 mm)

128 mil (3.2 mm)

Min.board thickness (2 layer board)

24 mil (0.6 mm)

12 mil (0.3 mm)

Min.board thickness (4 layer board)

24 mil (0.6 mm)

16 mil (0.3 mm)

Min.inner layer core thickness

4 mil (0.1 mm)

3 mil (0.08 mm)

Max.working panel

18” x 20” (457.2 x 508 mm)

18” x 20” (457.2 x 508 mm)

Max.inner layer copper thickness

1.0 oz

2.0 oz

Min.inner layer copper thickness

0.5 oz

0.3 oz

Max.outer layer copper thickness

2.0 oz

2.0 oz

Min.outer layer copper thickness

0.3 oz

NR

Min.mechanical drill size

10 mil (0.25 mm)

8 mil (0.2 mm)

Min.laser drill size

6 mil (0.15 mm)

4 mil (0.1 mm)

Aspect ratio

6.0/1.0

8.0/1.0

Outer layer line width / space

4 mil / 4 mil

3 mil / 3 mil

Inner layer line width / space

4 mil / 4 mil

3 mil / 3 mil

Min.SMT space

12 mil (0.3 mm)

12 mil (0.3 mm)

Min.BGA space

40 mil (1.0mm)

30 mil (0.75 mm)

Min.annular Ring

4 mil (0.1 mm)

4 mil (0.1 mm)

Min.solder mask printed width

4 mil (0.1 mm)

3 mil (0.08 mm)

Solder mask accuracy

± 3 mil (0.08 mm)

± 2 mil (.0.5 mm)

Surface treatment

Entek, ENIG, HASL , Gold Plating

Immersion Sliver, Tin, Entek + Gold

- Plating, ENIG + immersion Sliver, 

ENIG + Immersion Sliver

Punch control

± 6 mil (0.15 mm)

± 4 mil (0.1 mm)

V-Cut line control

± 16 mil (0.4 mm)

± 16 mil (0.4 mm)

Board thickness control

± 10 %

± 5 %

Board warp control

± 0.7 %

± 0.5 %

Impedance control

± 10 %

± 7 %